Spinodal structures with bi-continuous topologies for heat transfer applications
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United States of America Patent
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Nov 28, 2023
Grant Date -
Jan 12, 2023
app pub date -
Nov 25, 2020
filing date -
Nov 25, 2019
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Abstract
Heat transfer devices, components thereof, and related methods are provided. Embodiments include heat transfer devices and/or heat transfer components including a spinodal structure having a bi-continuous topology obtained by modeling a spinodal decomposition process, wherein the spinodal structure having the bi-continuous topology is a spinodal shell structure or a spinodal solid structure. Embodiments include methods of making heat transfer devices and/or heat transfer components using additive manufacturing. Other further embodiments are provided in the present disclosure.
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