Manufacturing method of circuit board assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11825595
APP PUB NO 20230171875A1
SERIAL NO

17565538

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Abstract

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The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

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Patent Owner(s)

Patent OwnerAddress
GARUDA TECHNOLOGY CO LTD8F NO 8 BAOQIANG RD XINDIAN DIST NEW TAIPEI CITY 231 TAIWAN (R O C ) NEW TAIPEI
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDQINHUANGDAO
AVARY HOLDING (SHENZHEN) CO LTDSONGLUO ROAD YANCHUAN COMMUNITY YANLUO STREET BAO'AN DISTRICT SHENZHEN GUANGDONG PROVINCE 518105

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Mao-Feng Taoyuan, TW 28 57
Yang, Zhi-Hong Guangzhou, CN 9 3

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