Method for processing workpiece
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 21, 2023
Grant Date -
N/A
app pub date -
Dec 22, 2021
filing date -
Mar 29, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
According to an embodiment, a wafer (W) includes a layer (EL) to be etched, an organic film (OL), an antireflection film (AL), and a mask (MK1), and a method (MT) according to an embodiment includes a step of performing an etching process on the antireflection film (AL) by using the mask (MK1) with plasma generated in a processing container (12), in the processing container (12) of a plasma processing apparatus (10) in which the wafer (W) is accommodated, and the step includes steps ST3a to ST4 of conformally forming a protective film (SX) on the surface of the mask (MK1), and steps ST6a to ST7 of etching the antireflection film (AL) by removing the antireflection film (AL) for each atomic layer by using the mask (MK1) on which the protective film (SX) is formed.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2021 Application Filing Year
- H01J Class
- 2475 Applications Filed
- 1245 Patents Issued To-Date
- 50.31 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01J Class
- 0 % this patent is cited more than
- 2 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 21, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 21, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 21, 2035 |