Method and apparatus to develop lithographically defined high aspect ratio interconnects
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United States of America Patent
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Nov 21, 2023
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N/A
app pub date -
Dec 2, 2021
filing date -
Dec 28, 2017
priority date (Note) -
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Abstract
Disclosed is a method to develop lithographically defined high aspect ratio interconnects. Also disclosed is an apparatus comprising at least one vessel having a bottom and at least one sidewall extending from the bottom, wherein the at least one sidewall encloses an interior of the at least one vessel, a shaft having a proximal end and a distal end, wherein the distal end of the shaft extends into the interior of the at least one vessel, wherein the proximal end of the shaft is coupled to a motor, at least one support structure which extends laterally from the shaft, and a substrate attachment fixture on a distal end of the at least one support structure, wherein the at least one support structure and the substrate attachment fixture are within the interior of the at least one vessel.
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