DNQ-type photoresist composition including alkali-soluble acrylic resins
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United States of America Patent
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Nov 21, 2023
Grant Date -
Nov 10, 2022
app pub date -
Nov 12, 2020
filing date -
Nov 14, 2019
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Abstract
Describe herein is a composition comprising: an acrylic polymer comprising repeat units selected from ones having structure (1), (2), (3), (4), (5), (6), and (7) wherein these repeat units are present in said acrylic polymer in the mole % ranges as described herein; a Novolak resin having a dissolution rate in 0.26 N aqueous TMAH of at least 50 Å/sec; a diazonaphthoquinone (DNQ) photoactive compound (PAC); and an organic spin casting solvent, and a process of using said composition as a positive photoresist developable in aqueous base.
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