Airlaid substrates having at least one bicomponent fiber
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United States of America Patent
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Nov 21, 2023
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app pub date -
Dec 10, 2018
filing date -
Dec 10, 2018
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Abstract
An airlaid substrate includes at least one bicomponent fiber having a first region and a second region. The first region includes polypropylene and the second includes a blend of an ethylene-base polymer and an ethylene acid copolymer. The ethylene-base polymer has a density from 0.920 g/cm3 to 0.970 g/cm3 and a melt index (I2) from 0.5 g/10 min to 150 g/10 min. The ethylene acid copolymer includes the polymerized reaction product of from 60 wt % to 99 wt % ethylene monomer and from 1 wt % to 40 wt % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer. The ethylene acid copolymer having a melt index (I2) from 0.5 g/10 min to 500 g/10 min.
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