Soldering apparatus and method of detecting failures of gasket

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United States of America Patent

PATENT NO 11819952
SERIAL NO

17328197

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Abstract

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Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiyama, Tsutomu Tokyo, JP 18 69
Kojima, Nobuhiro Tokyo, JP 4 4

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