Semiconductor device package

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United States of America Patent

PATENT NO 11817397
SERIAL NO

17129641

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Abstract

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A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INC26 CHIN 3RD RD 811 NANTZE EXPORT PROCESSING ZONE KAOHSIUNG R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Yu-Che Kaohsiung, TW 31 143
Lai, Lu-Ming Kaohsiung, TW 68 134
Liu, Hui-Chung Kaohsiung, TW 11 10
Tseng, Chi Sheng Kaohsiung, TW 17 32

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