Gold sputtering target

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United States of America Patent

PATENT NO 11817299
APP PUB NO 20230126513A1
SERIAL NO

18088454

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Abstract

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A gold sputtering target is made of gold and inevitable impurities, and has a surface to be sputtered. In the gold sputtering target, an average value of Vickers hardness is 40 or more and 60 or less, and an average crystal grain size is 15 μm or more and 200 μm or less. A {110} plane of gold is preferentially oriented at the surface to be sputtered.

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Patent Owner(s)

Patent OwnerAddress
TANAKA KIKINZOKU KOGYO K K7-3 MARUNOUCHI 2-CHOME CHIYODA-KU TOKYO 100-6422

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishikura, Chiharu Tomioka, JP 5 4
Kato, Tetsuya Tomioka, JP 131 1566
Mizuno, Yohei Tomioka, JP 4 3

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3687790501 - 1011 - 2001000200030004000250500750125015001750225025002750325035003750

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