Solderless BGA interconnect
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United States of America Patent
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Nov 7, 2023
Grant Date -
Apr 16, 2020
app pub date -
Oct 11, 2018
filing date -
Oct 11, 2018
priority date (Note) -
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Abstract
Embodiments disclosed herein include electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first substrate and a plurality of first conductive pads on the first substrate. In an embodiment, the electronics package further comprises a second substrate and a plurality of second conductive pads on the second substrate. In an embodiment, the electronics package further comprises a plurality of interconnects between the first and second substrate. In an embodiment, each interconnect electrically couples one of the first conductive pads to one of the second conductive pads. In an embodiment, the interconnects comprise strands of conductive material that are woven on themselves to form a mesh-like structure.
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