Sensor

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United States of America Patent

PATENT NO 11810863
APP PUB NO 20200185327A1
SERIAL NO

16430993

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

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Patent Owner(s)

Patent OwnerAddress
TDK TAIWAN CORPTAOYUAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukai, Tsutomu Taoyuan, TW 6 12
Tai, Chun-Yang Taoyuan, TW 1 2
Tseng, An-Ping Taoyuan, TW 7 30
Wu, Chi-Fu Taoyuan, TW 9 182
Wu, Hao-Yu Taoyuan, TW 21 384
Wu, Ming-Hung Taoyuan, TW 21 77

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