Heat sink configuration for multi-chip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 7, 2023
Grant Date -
N/A
app pub date -
Jun 28, 2021
filing date -
Jun 29, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully