Plasma source and method for removing materials from substrates utilizing pressure waves
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United States of America Patent
Stats
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Nov 7, 2023
Grant Date -
Jun 17, 2021
app pub date -
Jan 29, 2021
filing date -
Feb 8, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a method is provided for removing a material from a substrate, a plasma is generated at atmospheric pressure. The plasma includes an energetic species reactive with one or more components of the material. The plasma is flowed from an outlet as a plasma plume that includes periodic regions of high plasma density and low plasma density. The material is exposed to the plasma plume. At least one component of the material reacts with the energetic species, and at least one other component of the material is physically impacted and moved by one or more of the regions of high plasma density.
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International Classification(s)
- H01J:ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- B08B:CLEANING IN GENERAL; PREVENTION OF FOULING IN GENE....
- H05H:PLASMA TECHNIQUE
- B44D:PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVID....
- C23G:CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CH....
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Patent Citation Ranking
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- H01J Class
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- 2 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 7, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 7, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 7, 2035 |
