Thin film coating packaging for device having meltable and wetting links

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United States of America Patent

PATENT NO 11807770
SERIAL NO

17331808

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Abstract

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A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE INC8755 WEST HIGGINS ROAD SUITE 500 CHICAGO IL 60631

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Golubovic, Boris Chicago, US 33 322
Matus, Yuriy Borisovich Pleasanton, US 17 4
Nayar, Deepak Chicago, US 5 59
Pineda, Martin G Fremont, US 23 8

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