Three-dimensional features formed in molded panel

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United States of America Patent

PATENT NO 11807523
SERIAL NO

17482309

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Abstract

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Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT-PACKARD DEVELOPMENT COMPANY L P10300 ENERGY DRIVE SPRING TX 77389

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 409 3027
Groh, Michael G Corvallis, US 25 177
Mourey, Devin A Corvallis, US 9 503

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