Thermo-conductive bonding of laser rods with mechanical isolation
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United States of America Patent
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-
Oct 31, 2023
Grant Date -
N/A
app pub date -
Jun 18, 2020
filing date -
Jun 18, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus and method for mounting a laser rod includes a mount having a cylindrical through hole in which the laser rod is disposed. A polymer is disposed in the cylindrical through hole in an annular space between an outer diameter of the laser rod and an inner diameter of the cylindrical through hole. The laser rod is suspended in a symmetrical thermal and mechanical interface. There is open access to the ends of the laser rod for end pumping and laser cavity alignment.
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Patent Citation Ranking
- 1 Citation Count
- H01S Class
- 85.56 % this patent is cited more than
- 2 Age
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