Multilayer electronic component

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United States of America Patent

PATENT NO 11804331
SERIAL NO

17375323

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baik, Seung In Suwon-si, KR 22 52
Hong, Ji Su Suwon-si, KR 16 12
Jang, Eun Ha Suwon-si, KR 8 10
Kim, Hyoung Uk Suwon-si, KR 26 62
Lee, Chung Eun Suwon-si, KR 21 145
Park, Jae Sung Suwon-si, KR 92 362

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