Optical probe for optoelectronic integrated circuits
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United States of America Patent
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Oct 31, 2023
Grant Date -
Oct 5, 2023
app pub date -
Jun 13, 2022
filing date -
Mar 31, 2022
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Abstract
An optical probe for optoelectronic integrated circuits is provided, applicable to a test environment for testing a plurality of optical chips on a wafer. The optical chips include at least one optical waveguide, and the optical probe includes a substrate and an optical fiber. The facet of the optical fiber has a first angle, and the first angle causes the optical signal transmitted by the optical fiber to generate total reflection, and the optical signal after total reflection enters the optical waveguide of the optical chip. Thereby, an optical probe able to perform testing before wafer cutting and polishing is provided, and a high-speed, effective and reliable detection is achieved.
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