Half buried nFET/pFET epitaxy source/drain strap

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United States of America Patent

PATENT NO 11798867
APP PUB NO 20210313252A1
SERIAL NO

17351393

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Abstract

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A method is presented for reducing parasitic capacitance. The method includes forming a p-type epitaxial region and an n-type epitaxial region over a substrate, depositing an epitaxial growth over the p-type epitaxial region and the n-type epitaxial region, depositing a first dielectric between the p-type epitaxial region and the n-type epitaxial region such that an airgap is defined therebetween, and selectively removing the epitaxial growth to expose top surfaces of the p-type and n-type epitaxial regions. The method further includes depositing a second dielectric in direct contact with the exposed top surfaces of the p-type and n-type epitaxial regions, selectively etching the first and second dielectrics to form a strapped contact, and applying a metallization layer over the strapped contact.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doris, Bruce B Hartsdale, US 797 13759
Reznicek, Alexander Troy, US 1451 12717
Xie, Ruilong Niskayuna, US 1683 12538
Zhang, Jingyun Albany, US 218 1431

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