Surface treatment method of copper for the assembly of polymer and copper
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United States of America Patent
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Oct 24, 2023
Grant Date -
Dec 22, 2022
app pub date -
Jun 16, 2022
filing date -
Jun 18, 2021
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Abstract
A method to treat the copper surface to manufacture the metallic assembly with the polymer and copper to have excellent bonding strength is disclosed. The present method is for treating the surface of copper for the bonded coupling of the mixture of polymer and copper by providing a method to treat the surface of copper, with
- (a) an etching step with electric etching of the surface of copper,(b) the first anodizing stage to anodize the surface of copper, and(c) the second anodizing stage to anodize the above is firstly anodized, after an ultrasonic treatment of the secondly anodized copper, the copper is oxidized again.
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