Circuit board assembly and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11792914
APP PUB NO 20230171876A1
SERIAL NO

17564995

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Abstract

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The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

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Patent Owner(s)

Patent OwnerAddress
GARUDA TECHNOLOGY CO LTD8F NO 8 BAOQIANG RD XINDIAN DIST NEW TAIPEI CITY 231 TAIWAN (R O C ) NEW TAIPEI
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTDQINHUANGDAO
AVARY HOLDING (SHENZHEN) CO LTDSONGLUO ROAD YANCHUAN COMMUNITY YANLUO STREET BAO'AN DISTRICT SHENZHEN GUANGDONG PROVINCE 518105

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Mao-Feng Taoyuan, TW 28 57
Yang, Zhi-Hong Guangzhou, CN 9 3

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