Method of fabricating semiconductor package and semiconductor package
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United States of America Patent
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Oct 17, 2023
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N/A
app pub date -
Jan 20, 2022
filing date -
Dec 19, 2018
priority date (Note) -
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Abstract
A method of fabricating a semiconductor package includes preparing a panel package including a redistribution substrate, a connection substrate and a plurality of lower semiconductor chips; sawing the panel package to form a plurality of separated strip packages each of which includes the sawed redistribution substrate, at least two of the lower semiconductor chips, and the sawed connection substrate; and providing a plurality of upper semiconductor chips on one of the strip packages to electrically connect the upper semiconductor chips to the sawed connection substrate.
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