Direct bonded heterogeneous integration silicon bridge

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11791270
APP PUB NO 20220359401A1
SERIAL NO

17315859

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Abstract

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A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andry, Paul S Yorktown Heights, US 122 1998
Bergendahl, Marc A Rensselaer, US 100 1307
Bonam, Ravi K Albany, US 21 63
Bureau, Charles C Bromont, CA 3 2
Cournoyer, Maryse Granby, CA 7 56
De, Sousa Isabel Chambly, CA 15 34
Dufort, Catherine Bromont, CA 5 15
Gagnon, Pascale Brigham, CA 6 29
Khanna, Vijayeshwar Das Millwood, US 19 271
Liu, Yang Yorktown Heights, US 1941 7962
McHerron, Dale Curtis Staatsburg, US 7 63
Mori, Hiroyuki Yasu, JP 401 3349
Parekh, Dishit Paresh Guilderland, US 5 6
Sikka, Kamal K Poughkeepsie, US 95 867

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