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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
EBARA CORPORATION	11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510 ?1448510

International Classification(s)

• C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
• B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Dou, Chunhui	Tokyo, JP	4	2
Kimura, Risa	Tokyo, JP	9	2
Yamakawa, Junitsu	Tokyo, JP	16	77
Yokoyama, Toshio	Tokyo, JP	76	921

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Apr 10, 2027
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 10, 2031
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 10, 2035

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 11781233

Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank

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