Method and apparatus for substrate stripping

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United States of America Patent

PATENT NO 11780108
SERIAL NO

17171552

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Abstract

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Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.

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Patent Owner(s)

Patent OwnerAddress
HIGHCON SYSTEMS LTD8122503 YAVNE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ben-David, David Rehovot, IL 43 54
Ireni, Eli Raanana, IL 5 7
Zimmer, Michael Beit Elazari, IL 33 136

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