Exhaust module for wafer baking apparatus and wafer processing system having the same
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United States of America Patent
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Oct 10, 2023
Grant Date -
Jun 25, 2020
app pub date -
Oct 23, 2019
filing date -
Dec 21, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure provides an exhaust module for exhausting an exhaust from at least one wafer baking apparatus having an exhaust port. The exhaust module includes at least one pipeline, a heating unit, a solvent dispensing unit, and a filtering unit. The at least one pipeline is connected to the exhaust port of the wafer baking apparatus and configured to exhaust the exhaust gas from the wafer baking apparatus. The heating unit is connected to the pipeline and configured to heat the exhaust gas. The solvent dispensing unit is connected to the heating unit and configured to dispense a solvent to cool and dissolve the exhaust gas. The filtering unit is connected to the solvent dispensing unit and configured to filter the solvent.
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