Semiconductor device having a node capping pattern and a gate capping pattern

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United States of America Patent

PATENT NO 11778801
SERIAL NO

17185102

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Abstract

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A semiconductor device comprises a first gate structure extending in a first direction and including a first gate electrode and a first gate capping pattern, a second gate structure spaced apart from the first gate structure and extending in the first direction, and including a second gate electrode and a second gate capping pattern, an active pattern extending in a second direction, the active pattern below the second gate structure, an epitaxial pattern on one side of the second gate structure and on the active pattern, a gate contact connected to the first gate electrode, and a node contact connected to the second gate electrode and to the epitaxial pattern. An upper surface of the gate contact is at a same level as the first gate capping pattern, and an upper surface of the node contact is lower than the upper surface of the first gate capping pattern.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gwak, Min Chan Hwaseong-si, KR 13 36
Hwang, Jeong Ki Suwon-si, KR 2 1
Jung, Sung Hun Suwon-si, KR 9 40
Lee, Sung Moon Suwon-si, KR 11 15
Shin, Heon Jong Yongin-si, KR 23 97

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