Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap
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United States of America Patent
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Oct 3, 2023
Grant Date -
N/A
app pub date -
Feb 10, 2022
filing date -
Mar 30, 2018
priority date (Note) -
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Abstract
A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. An encapsulant is over the protrusion of the substrate, the encapsulant extending beneath the first die, and the encapsulant extending beneath the second die.
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