Multilayer ceramic electronic component
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United States of America Patent
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Oct 3, 2023
Grant Date -
Jul 15, 2021
app pub date -
Oct 1, 2020
filing date -
Jan 14, 2020
priority date (Note) -
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Abstract
A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 μm to 10 μm.
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