Protector cap for package with thermal interface material

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United States of America Patent

PATENT NO 11769701
SERIAL NO

17175967

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Importance

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Abstract

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A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AUSTRIA AGSIEMENSSTRASSE 2 VILLACH 9500

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasztelan, Christian Penang, MY 15 85
Khoo, Nee Wan Melaka, MY 10 22

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