Method and apparatus for removing particles from the surface of a semiconductor wafer
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United States of America Patent
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Sep 26, 2023
Grant Date -
Jun 8, 2023
app pub date -
Dec 3, 2021
filing date -
Dec 3, 2021
priority date (Note) -
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Abstract
A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.
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