Automatic soldering processing system and automatic soldering processing method
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United States of America Patent
Stats
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Sep 26, 2023
Grant Date -
Feb 16, 2023
app pub date -
Dec 7, 2021
filing date -
Aug 12, 2021
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An automatic soldering processing system is disclosed and includes a soldering-point information obtaining unit, a soldering-parameter generating unit, a solder feeding unit, an iron tip, a motion control unit, and a temperature control unit. The soldering-point information obtaining unit obtains an image of at least one soldering-point of an electronic product, the soldering-parameter generating unit generates soldering parameters such as solder feeding speed, solder feeding amount, moving speed, moving path, heating temperature and heating time for the at least one soldering-point correspondingly according to the image. The solder feeding unit feeds solder based on the solder feeding speed and the solder feeding amount, the iron tip performs a soldering action by using the solder, and the motion control unit and the temperature control unit control the iron tip according to the moving speed, the moving path, the heating temperature, and the heating time.
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 26, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 26, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 26, 2035 |
