Method of making semiconductor device and semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 19, 2023
Grant Date -
Nov 17, 2022
app pub date -
Jul 28, 2022
filing date -
May 26, 2017
priority date (Note) -
In Force
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Abstract
A method of making a semiconductor structure includes forming a plurality of gate electrodes over a plurality of active regions. The method further includes increasing a width of a portion of each of the plurality of gate electrodes between adjacent active regions of the plurality of active regions, wherein increasing the width of the portion of each of the plurality of gate electrodes comprises increasing the width of less than an entirety of each of the plurality of gate electrodes between the adjacent active regions. The method further includes removing a central region of each of the plurality of gate electrodes, wherein the central region has the increased width, and removing the central region comprises removing less than an entirety of the portion of each of the plurality of gate electrodes.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD | HSINCHU |
International Classification(s)

- 2022 Application Filing Year
- H01L Class
- 27731 Applications Filed
- 8200 Patents Issued To-Date
- 29.57 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Yu-Jen | Hsinchu, TW | 328 | 929 |
# of filed Patents : 328 Total Citations : 929 | |||
Huang, I-Shan | Hsinchu, TW | 20 | 28 |
# of filed Patents : 20 Total Citations : 28 | |||
Hung, Chan-Yu | Hsinchu, TW | 17 | 12 |
# of filed Patents : 17 Total Citations : 12 | |||
Wang, Ling-Sung | Hsinchu, TW | 120 | 1168 |
# of filed Patents : 120 Total Citations : 1168 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 2 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 19, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 19, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 19, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jan 28, 2025 | P | Publication | |
Jan 08, 2025 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Dec 16, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED |
Dec 13, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: PUBLICATIONS -- ISSUE FEE PAYMENT RECEIVED |
Dec 03, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
Nov 07, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
Jul 30, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Jul 25, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
May 20, 2024 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: NON FINAL ACTION MAILED |
Nov 24, 2022 | P | Published | |
Sep 09, 2022 | STPP | INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL | free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
Mar 09, 2022 | FEPP | FEE PAYMENT PROCEDURE | free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jan 26, 2022 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ITO, YASUKI;SATOH, NORIYUKI;REEL/FRAME:059214/0660 Owner name: DENKA COMPANY LIMITED, JAPAN Effective Date: Jan 26, 2022 |
Sep 09, 2020 | F | Filing | |
Sep 10, 2019 | PD | Priority Date |

Matter Detail

Renewals Detail
