Printed circuit board
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United States of America Patent
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-
Sep 12, 2023
Grant Date -
N/A
app pub date -
Apr 5, 2021
filing date -
Nov 30, 2020
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.
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