Detection of force applied by pick-up tool for transferring semiconductor devices
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United States of America Patent
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Sep 12, 2023
Grant Date -
N/A
app pub date -
Dec 27, 2019
filing date -
Dec 27, 2019
priority date (Note) -
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Abstract
A pick-up head picks up a semiconductor device from a carrier substrate. The pick-up head includes a first leg portion, a second leg portion, a raised bridge base portion between the first and second leg portions, and a tip portion mounted on the raised bridge base portion. The tip portion engages with the semiconductor device to pick up the semiconductor device from the carrier substrate. The pick-up head is associated with a force detection mechanism that detects a force applied to the pick-up head for picking up the semiconductor device. The force detection mechanism includes cavities formed on the first leg portion and/or second leg portion, pillars arranged on the pick-up head, a force detection device arranged in a mount assembly that is attached on the pick-up head, or electrodes arranged on the mount assembly. Actuation of the pick-up head is determined based on the detected force.
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