Semiconductor module
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United States of America Patent
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Sep 5, 2023
Grant Date -
N/A
app pub date -
Nov 4, 2021
filing date -
May 14, 2019
priority date (Note) -
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Abstract
A semiconductor module includes: a semiconductor element; and a sealing member. The semiconductor element includes: a semiconductor substrate; a protection film on the semiconductor substrate; a metal film on the semiconductor substrate and having at least a part located between the semiconductor substrate and the protection film; and a dummy metal film on the semiconductor substrate between the metal film and the protection film. The surface of the semiconductor substrate has a recess. The protection film has an other recess or a hole. The dummy metal film is arranged in both the recess of the semiconductor substrate and the other recess or the hole of the protection film.
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