Grinding method of composite substrate including resin and grinding apparatus thereof
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United States of America Patent
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Sep 5, 2023
Grant Date -
Jun 25, 2020
app pub date -
Dec 10, 2019
filing date -
Dec 20, 2018
priority date (Note) -
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Abstract
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be effectively performed with high precision. This method for grinding a front surface of a composite substrate formed with a resin substrate embedded with at least one of a semiconductor device chip and an electrode, includes: bringing at least a part of a grinding member for grinding the front surface of the composite substrate into contact with the front surface; supplying water to at least one of a contacting part or a non-contacting part between the front surface of the composite substrate and the grinding member; and grinding the front surface of the composite substrate simultaneously with the supplying water.
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