Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same

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United States of America Patent

PATENT NO 11742328
SERIAL NO

17384729

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Abstract

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A semiconductor device assembly comprises a substrate including internal contacts on a first side and first external contacts on a second side. The assembly further comprises one or more first dies disposed over the first side and electrically coupled to the internal contacts, and a interposer having a length and a width less than a length and a width of the substrate, having inner contacts on a first side, and having second external contacts on a second side. The interposer is coupled to the second side of the substrate by one or more of the inner contacts. The assembly further comprises a second die disposed between the substrate and the interposer. The assembly further comprises first solder balls on the first external contacts, and second solder balls on the second external contacts. The first and second solder balls are configured to bond with co-planar package contacts.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY P O BOX 6 M/S 1-525 BOISE ID 83716-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Monadgemi, Pezhman Santa Clara, US 44 1134

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