Interface of integrated circuit die and method for arranging interface thereof

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United States of America Patent

PATENT NO 11742295
SERIAL NO

17134534

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Abstract

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An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU
GLOBAL UNICHIP CORPORATIONNO 10 LI-HSIN 6TH ROAD HSINCHU SCIENCE PARK HSINCHU CITY 30078

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chia-Hsiang Hsinchu, TW 37 212
Chang, Yu-Ju Hsinchu, TW 5 3
Chen, Chun-Hsu Hsinchu, TW 31 158
Chen, Jia-Liang Hsinchu, TW 16 67
Chen, Yen-Chung T Santa Clara, US 9 11
Chen, Yen-Wei Hsinchu, TW 14 67
Chien, Ting-Hsu Hsinchu, TW 24 38
Cho, Ting-Chin Hsinchu, TW 3 3
Elkanovich, Igor Hsinchu, TW 25 69
Huang, Chao-Ching Hsinchu, TW 21 80
Lin, Li-Hua Hsinchu, TW 14 51
Lin, Yuan-Hung Hsinchu, TW 11 30
Parnass, Amnon Hsinchu, TW 9 4
Tseng, Li-Ya Hsinchu, TW 2 0
Wang, Chung-Kai Hsinchu, TW 36 159
Wang, Ting-Hao Hsinchu, TW 38 80
Yang, Tsai-Ming Hsinchu, TW 13 16
Yang, Zanyu Hsinchu, TW 1 0
Yu, Pei Hsinchu, TW 36 69

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