Conductive paste composition
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United States of America Patent
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Aug 29, 2023
Grant Date -
Jul 21, 2022
app pub date -
May 27, 2020
filing date -
Jun 12, 2019
priority date (Note) -
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Abstract
A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.
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