Heat-activated multiphase fluid-operated pump for electronics waste heat removal
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United States of America Patent
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Aug 22, 2023
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N/A
app pub date -
Sep 10, 2021
filing date -
Sep 10, 2020
priority date (Note) -
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Abstract
A heat-activated pump removes waste heat from electronic components, at a data center, circuit board, or chip level. A set of evaporators receive heat from the electronics, converting a working fluid into vapor. Piping from the evaporators to a shared condenser(s) and back form a fluid circulation system. A pressure-control valve set for a specified electronic operating temperature allows vaporized working fluid to vent into a liquid-piston chamber, where it expands adiabatically, displacing pumped liquid in a pumping stage and expelling it from the chamber through a unidirectional valve to the shared condenser(s). The condenser(s) has a heatsink transferring heat away to a flow of cooler fluid. The pumped liquid returns in a suction cycle to the chamber through another unidirectional valve. An injector valve returns jets of condensed working fluid to the evaporator in successive brief spurts responsive to periodic pressure pulses in the chamber.
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