Method and apparatus for manufacturing semiconductor device
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United States of America Patent
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Aug 22, 2023
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N/A
app pub date -
Aug 15, 2019
filing date -
Aug 21, 2018
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Abstract
A method for manufacturing a semiconductor device includes chucking in which a semiconductor device wafer is attached to an upper surface of a chuck mechanism with its device surface down; and edge trimming performed after the chucking, wherein the edge trimming comprises: rotating the semiconductor device water horizontally by the chuck mechanism; rotating a rotating blade horizontally by a vertical spindle to which an ultrasonic wave is applied and trimming a circumferential side surface of the semiconductor device wafer by the rotating blade.
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