Grounding plate and methods of shipping and installing a grounding plate
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United States of America Patent
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Aug 15, 2023
Grant Date -
Oct 8, 2020
app pub date -
Apr 1, 2020
filing date -
Apr 3, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A method of transporting grounding plates is provided, having a step of providing a plurality of grounding plates made from an electrically conductive material. Each grounding plate has a plate body with first and second faces that are planar, opposed, and parallel to each other, and a grounding connector formed from the same material and having a first end connected to the plate body. The grounding connector is bendable about the first end from a planar configuration to a functional configuration. In the planar configuration, the grounding connector is aligned with and parallel to the first and second faces of the plate body, and in the functional configuration, the grounding connector is at an angle relative to the first face of the plate body. The method has the further steps of stacking the plurality of grounding plates in the planar configuration and transporting the stack to a destination.
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