Semiconductor package assembly having a conductive electromagnetic shield layer

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United States of America Patent

PATENT NO 11728292
APP PUB NO 20200168572A1
SERIAL NO

16779217

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Abstract

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The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first redistribution layer (RDL) structure having a first surface and a second surface opposite to the first substrate. The first RDL structure includes a plurality of first conductive traces close to the first surface of the first RDL structure. An antenna pattern is disposed close to the second surface of the first RDL structure. A first semiconductor die is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. A plurality of conductive structures is disposed on the first surface of the first RDL structure and electrically coupled to the first RDL structure. The plurality of conductive structures is spaced apart from the antenna pattern through the plurality of first conductive traces of the first RDL structure.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCNO 1 DUSING RD 1ST SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Che-Ya Kaohsiung, TW 40 457
Huang, Wei-Che Zhudong Township, Hsinchu County, TW 41 388
Lin, Tzu-Hung Hsin-Chu, TW 114 978
Liu, Nai-Wei Hsin-Chu, TW 62 4313
Peng, I-Hsuan Hsinchu, TW 69 682

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