Wafer bonding apparatuses
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United States of America Patent
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Aug 15, 2023
Grant Date -
Nov 26, 2020
app pub date -
Dec 4, 2019
filing date -
May 23, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.
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