Low footprint optical interconnects

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United States of America Patent

PATENT NO 11726274
SERIAL NO

17516583

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Abstract

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Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

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Patent Owner(s)

Patent OwnerAddress
WAVEFRONT RESEARCH INC1540 MAIN STREET NORTHAMPTON PA 18067

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Stone, Thomas W Hellertown, US 79 1097
Veitch, Randall C Nazareth, US 15 41

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