METHOD AND DEVICE FOR LIQUID SPRAY SOLDERING AND THE APPLICATION METHOD THEREOF

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United States of America Patent

PATENT NO 20230278126
APP PUB NO 20230278126A1
SERIAL NO

17901650

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Abstract

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The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.

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International Classification(s)

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  • 2022 Application Filing Year
  • B05B Class
  • 1063 Applications Filed
  • 345 Patents Issued To-Date
  • 32.46 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CAI, Shihong Shenzhen, CN 1 0
CAI, Yunfeng Shenzhen, CN 6 3
DU, Junkuan Shenzhen, CN 1 0
HUANG, Yanling Shenzhen, CN 4 4
LI, Shengli Shenzhen, CN 7 382
TAN, Zhengdong Shenzhen, CN 1 0
WANG, Haiming Shenzhen, CN 532 4180
WANG, Haiying Shenzhen, CN 49 373
ZHOU, Xuan Shenzhen, CN 67 122

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  • B05B Class
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges107814301 - 100501001502002503003504004505005506006507007508008509009501000105011001150

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