Semiconductor device and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11721672
APP PUB NO 20220285320A1
SERIAL NO

17459866

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a first stacked body including a plurality of first semiconductor chips stacked along a first direction, each of the first semiconductor chips being offset from the other first semiconductor chips along a second direction perpendicular to the first direction; a first columnar electrode connected to an electrode pad of the first stacked body, and extending in the first direction; a second stacked body including a plurality of second semiconductor chips stacked along the first direction, each of the second semiconductor chips being offset from the other second semiconductor chips along the second direction, the second stacked body having a height larger than the first stacked body and overlap at least a portion of the first stacked body when viewed from the top; and a second columnar electrode connected to an electrode pad of the second stacked body, and extending in the first direction.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATION1-21 SHIBAURA 3-CHOME MINATO-KU TOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Kazuma Kanagawa, JP 43 192
Miura, Masayuki Tokyo, JP 67 508
Sano, Yuichi Tokyo, JP 41 80

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