Glass substrate and laminated substrate

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United States of America Patent

PATENT NO 11715673
APP PUB NO 20210343610A1
SERIAL NO

17367762

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Abstract

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The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.

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Patent Owner(s)

Patent OwnerAddress
AGC INC5-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8405

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hanashima, Keisuke Tokyo, JP 10 28
Hanawa, Yu Tokyo, JP 15 33
Nomura, Shuhei Tokyo, JP 27 69
Ono, Kazutaka Tokyo, JP 90 778
Sawamura, Shigeki Tokyo, JP 38 372
Takeshita, Nobuhiko Tokyo, JP 16 46

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