Integrated antenna on interposer substrate
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United States of America Patent
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Aug 1, 2023
Grant Date -
Oct 28, 2021
app pub date -
Jul 9, 2021
filing date -
Feb 27, 2013
priority date (Note) -
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Abstract
The present disclosure relates to a semiconductor module. The semiconductor module includes an excitable element located on a first side of a substrate. A first ground structure is disposed between the first side of the substrate and the excitable element. The first ground structure includes a conductive via extending through the substrate and an interconnect disposed over a topmost surface of the conductive via facing away from the substrate. A second ground structure is located on a second side of the substrate, opposing the first side, and electrically coupled to the first ground structure.
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